Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 1 month agoHuawei Expected to Break Semiconductor Barriers with Development of High-End 3nm GAA Chips; Tape-Out by 2026wccftech.comexternal-linkmessage-square1linkfedilinkarrow-up11arrow-down10
arrow-up11arrow-down1external-linkHuawei Expected to Break Semiconductor Barriers with Development of High-End 3nm GAA Chips; Tape-Out by 2026wccftech.comAlphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 1 month agomessage-square1linkfedilink
minus-squaregolli@lemm.eelinkfedilinkEnglisharrow-up0·1 month agoI’m curious to see how this claim eventually turns out. I kind of doubt it’ll be a true 3nm class chip without EUV, but regardless I am sure they are making some decent progress.
I’m curious to see how this claim eventually turns out. I kind of doubt it’ll be a true 3nm class chip without EUV, but regardless I am sure they are making some decent progress.